The Project of 'Research on High-precision Chip-based Epoxy Resin Packing NTC Thermistors' Passed the Acceptance
Editor: | Aug 18,2010
The project was set up in 2008 by the Urumqi Technology Bureau and was a new product development project. The experts listened to the achievements of the project group, verified the results and sample development, the use of project funds and the results on the product's, and asked about industrial prospects and other issues. The experts group agreed that the project was successful completed, trained new technical staff, achieved the purpose of an innovative seed fund to support, and the project passed the acceptance. The Group also proposed to speed up the pace of industrialization, further improve the production equipment, efficiency and yield of the products.
Researcher Cui Wangcheng, deputy director of XJIPC, participated in the project acceptance.
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