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Position in International Organization

  • Qiwen Zheng  / 
  • Education:
    Direction:  
  • E-mail: qwzheng@ms.xjb.ac.cn
    Postal Code: 830011
  • Address: Technical Institute of Physics & Chemistry Chinese Academy of Sciences 40-1 South Beijing Road Urumqi, Xinjiang 830011 China
Resume

2019/11-Present Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Associate Professor

2015/07-2019/10 Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Assistant Research Fellow 

2010/09-2015.06 University of Chinese Academy of Sciences, Microelectronics and Solid-State Electronics, Ph. D. degree 

2005/09-2009/07 SHANDONG University, Applied Physics, B. S. degree
 
Main Research Areas and Achievements:  
Dr. Qiwen Zheng is mainly engaged in the research of radiation damage mechanism, model and reinforcement principle of advanced CMOS technology. He has published 56 papers in IEEE TNS, NSREC, RADECS and other famous journals and international conferences on radiation effects of semiconductor devices. He presided over and completed more than 5 scientific research projects such as the National Natural Science Foundation of China.
 
Main Honor:  

2021 First Prize of Science and Technology Progress of Xinjiang Uygur Autonomous Region (3rd) 

2020 Outstanding youth fund of Xinjiang Natural Science Foundation 

Outstanding Scientific and Technological Worker of the 8th Chinese Institute of Electronics 

2019 Youth Innovation Promotion Association of Chinese Academy of Sciences
 
Representative Publications 

[1] Zheng Qiwen, Cui Jiangwei, Yu Xuefeng, Li Yudong, Lu Wu, He Chengfa, and Guo Qi, “Impact of TID on Within-Wafer Variability of Radiation-Hardened SOI Wafers”, IEEE Transactions on Nuclear Science, 68(7): 1423-1429, 2021. 

[2] Zheng Qiwen, Cui Jiangwei, Yu Xuefeng, Li Yudong, Lu Wu, He Chengfa, and Guo Qi, “Measurement and Evaluation of the Within-Wafer TID Response Variability on BOX Layer of SOI Technology”, IEEE Transactions on Nuclear Science, 68(10): 2516-2523, 2021. 

[3] Zheng Qiwen, Cui Jiangwei, Xu Liewei, Ning Bingxu, Zhao Kai, Shen Mingjie, Yu Xuefeng, Lu Wu, He Chengfa, Ren Diyuan and Guo Qi, “Total Ionizing Dose Responses of Forward Body Bias Ultra-Thin Body and Buried Oxide FD-SOI Transistors”, IEEE Transactions on Nuclear Science, 66(4): 702-709, 2019. 

[4] Zheng Qiwen, Cui Jiangwei, Lu Wu, Guo Hongxia, Liu Jie, Yu Xuefeng, Wang Liang, Liu Jiaqi, He Chengfa, Ren Diyuan, Yue Suge, Zhao Yuanfu and Guo Qi, “Total Ionizing Dose Influence on the Single-Event Multiple-Cell Upsets in 65-nm 6-T SRAM”, IEEE Transactions on Nuclear Science, 66(6): 892-898, 2019. 

[5] Zheng Qiwen, Cui Jiangwei, Yu Xuefeng, Lu Wu, He Chengfa, Ma Teng, Zhao Jinghao, Ren Diyuan and Guo Qi, “Read Static Noise Margin Decrease of 65-nm 6-T SRAM Cell Induced by Total Ionizing Dose”, IEEE Transactions on Nuclear Science, 65(2): 691-697, 2018. 

[6] Zheng Qiwen, Cui Jiangwei, Lu Wu, Guo Hongxia, Liu Jie, Yu Xuefeng, Wei Ying, Wang Liang, Liu Jiaqi, He Chengfa and Guo Qi, “The Increased Single-Event Upset Sensitivity of 65-nm DICE SRAM Induced by Total Ionizing Dose”, IEEE Transactions on Nuclear Science, 65(8): 1920-1927, 2018. 

[7] Zheng Qiwen, Cui Jiangwei, Liu Mengxin, Zhou Hang, Liu Mohan, Wei Ying, Su Dandan, Ma Teng, Lu Wu, Yu Xuefeng, Guo Qi and He Chengfa, “Total Ionizing Dose Influence on the Single-Event Upset Sensitivity of 130-nm PD SOI SRAMs”, IEEE Transactions on Nuclear Science, 64(7): 1897-1904, 2017. 

[8] Xi Shanxue, Zheng Qiwen, Lu Wu, Cui Jiangwei, Wei Ying and Guo Qi, “Modeling of TID-induced leakage current in ultra-deep submicron SOI NMOSFETs”, Microelectronics Journal, 102: 104829-1-8, 2020. 

[9] Xi Shanxue, Zheng Qiwen, Wu Lu, Cui Jiangwei, Wei Ying, Wang Baoshun and Guo Qi, “The influence of channel width on total ionizing dose responses of the 130?nm H-gate partially depleted SOI NMOSFETs”, Radiation Effects and Defects in Solids, 175(5-6):1-8, 2020. 

[10] Zheng Qiwen, Cui Jiangwei, Wei Ying, Yu Xuefeng, Lu Wu, Ren Diyuan and Guo Qi, “Bias Dependence of Radiation-Induced Narrow-Width Channel Eects in 65 nm NMOSFETs”, CHIN.PHYS.LETT, 35(4): 046102-1-4, 2018.
   
Authorized Invention Patents: 

[1]Cui Jiangwei, Zheng Qiwen, Wei Ying, Sun Jing, Yu Xuefeng, Guo Qi, Lu Wu, he Chengfa, Ren Diyuan, A test method for the effect of total dose irradiation on the negative bias temperature instability of PMOSFET, zl201711329107.0 

[2]Zheng Qiwen, Cui Jiangwei, Li Xiaolong, Wei Ying, Yu Xuefeng, Li Yudong, Guo Qi, A circuit level total dose radiation effect simulation method, ZL202011125626.7 

[3]Zheng Qiwen, Cui Jiangwei, Li Xiaolong, Wei Ying, Yu Xuefeng, Li Yudong, Guo Qi, A circuit simulation method for coupling total dose effect and process fluctuation, ZL202011125363.X
 
Field of research: 
Microelectronics and Solid State Electronics
Commitment to research the situation

2019/11-Present Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Associate Professor

2015/07-2019/10 Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Assistant Research Fellow 

2010/09-2015.06 University of Chinese Academy of Sciences, Microelectronics and Solid-State Electronics, Ph. D. degree 

2005/09-2009/07 SHANDONG University, Applied Physics, B. S. degree
 
Main Research Areas and Achievements:  
Dr. Qiwen Zheng is mainly engaged in the research of radiation damage mechanism, model and reinforcement principle of advanced CMOS technology. He has published 56 papers in IEEE TNS, NSREC, RADECS and other famous journals and international conferences on radiation effects of semiconductor devices. He presided over and completed more than 5 scientific research projects such as the National Natural Science Foundation of China.
 
Main Honor:  

2021 First Prize of Science and Technology Progress of Xinjiang Uygur Autonomous Region (3rd) 

2020 Outstanding youth fund of Xinjiang Natural Science Foundation 

Outstanding Scientific and Technological Worker of the 8th Chinese Institute of Electronics 

2019 Youth Innovation Promotion Association of Chinese Academy of Sciences
 
Representative Publications 

[1] Zheng Qiwen, Cui Jiangwei, Yu Xuefeng, Li Yudong, Lu Wu, He Chengfa, and Guo Qi, “Impact of TID on Within-Wafer Variability of Radiation-Hardened SOI Wafers”, IEEE Transactions on Nuclear Science, 68(7): 1423-1429, 2021. 

[2] Zheng Qiwen, Cui Jiangwei, Yu Xuefeng, Li Yudong, Lu Wu, He Chengfa, and Guo Qi, “Measurement and Evaluation of the Within-Wafer TID Response Variability on BOX Layer of SOI Technology”, IEEE Transactions on Nuclear Science, 68(10): 2516-2523, 2021. 

[3] Zheng Qiwen, Cui Jiangwei, Xu Liewei, Ning Bingxu, Zhao Kai, Shen Mingjie, Yu Xuefeng, Lu Wu, He Chengfa, Ren Diyuan and Guo Qi, “Total Ionizing Dose Responses of Forward Body Bias Ultra-Thin Body and Buried Oxide FD-SOI Transistors”, IEEE Transactions on Nuclear Science, 66(4): 702-709, 2019. 

[4] Zheng Qiwen, Cui Jiangwei, Lu Wu, Guo Hongxia, Liu Jie, Yu Xuefeng, Wang Liang, Liu Jiaqi, He Chengfa, Ren Diyuan, Yue Suge, Zhao Yuanfu and Guo Qi, “Total Ionizing Dose Influence on the Single-Event Multiple-Cell Upsets in 65-nm 6-T SRAM”, IEEE Transactions on Nuclear Science, 66(6): 892-898, 2019. 

[5] Zheng Qiwen, Cui Jiangwei, Yu Xuefeng, Lu Wu, He Chengfa, Ma Teng, Zhao Jinghao, Ren Diyuan and Guo Qi, “Read Static Noise Margin Decrease of 65-nm 6-T SRAM Cell Induced by Total Ionizing Dose”, IEEE Transactions on Nuclear Science, 65(2): 691-697, 2018. 

[6] Zheng Qiwen, Cui Jiangwei, Lu Wu, Guo Hongxia, Liu Jie, Yu Xuefeng, Wei Ying, Wang Liang, Liu Jiaqi, He Chengfa and Guo Qi, “The Increased Single-Event Upset Sensitivity of 65-nm DICE SRAM Induced by Total Ionizing Dose”, IEEE Transactions on Nuclear Science, 65(8): 1920-1927, 2018. 

[7] Zheng Qiwen, Cui Jiangwei, Liu Mengxin, Zhou Hang, Liu Mohan, Wei Ying, Su Dandan, Ma Teng, Lu Wu, Yu Xuefeng, Guo Qi and He Chengfa, “Total Ionizing Dose Influence on the Single-Event Upset Sensitivity of 130-nm PD SOI SRAMs”, IEEE Transactions on Nuclear Science, 64(7): 1897-1904, 2017. 

[8] Xi Shanxue, Zheng Qiwen, Lu Wu, Cui Jiangwei, Wei Ying and Guo Qi, “Modeling of TID-induced leakage current in ultra-deep submicron SOI NMOSFETs”, Microelectronics Journal, 102: 104829-1-8, 2020. 

[9] Xi Shanxue, Zheng Qiwen, Wu Lu, Cui Jiangwei, Wei Ying, Wang Baoshun and Guo Qi, “The influence of channel width on total ionizing dose responses of the 130?nm H-gate partially depleted SOI NMOSFETs”, Radiation Effects and Defects in Solids, 175(5-6):1-8, 2020. 

[10] Zheng Qiwen, Cui Jiangwei, Wei Ying, Yu Xuefeng, Lu Wu, Ren Diyuan and Guo Qi, “Bias Dependence of Radiation-Induced Narrow-Width Channel Eects in 65 nm NMOSFETs”, CHIN.PHYS.LETT, 35(4): 046102-1-4, 2018.
   
Authorized Invention Patents: 

[1]Cui Jiangwei, Zheng Qiwen, Wei Ying, Sun Jing, Yu Xuefeng, Guo Qi, Lu Wu, he Chengfa, Ren Diyuan, A test method for the effect of total dose irradiation on the negative bias temperature instability of PMOSFET, zl201711329107.0 

[2]Zheng Qiwen, Cui Jiangwei, Li Xiaolong, Wei Ying, Yu Xuefeng, Li Yudong, Guo Qi, A circuit level total dose radiation effect simulation method, ZL202011125626.7 

[3]Zheng Qiwen, Cui Jiangwei, Li Xiaolong, Wei Ying, Yu Xuefeng, Li Yudong, Guo Qi, A circuit simulation method for coupling total dose effect and process fluctuation, ZL202011125363.X
 
Field of research: 
Microelectronics and Solid State Electronics
(86) 991-3838931
lhskj@ms.xjb.ac.cn
(86)991-3838957
40-1 Beijing Road Urumqi, XinjiangChina